# Damnang’s Substack

Welcome to my Substack.

Here, I share in depth analysis of semiconductor technology, companies, and industry trends in a way that is still easy for non specialists to follow.

I hope you gain many valuable insights along the way.

Over 11,000 subscribers

## Packaging, Foundry & Test

Analysis of advanced packaging, foundry strategy, yield, manufacturing bottlenecks, and semiconductor test, where real competitiveness is often decided.

### LATEST

**If CoPoS Arrives, Who Makes Money First**  
[If CoPoS Arrives, Who Makes Money First](https://damnang2.substack.com/p/if-copos-arrives-who-makes-money)  
43 / 3

**OSAT: The Final Bottleneck in AI Chips**  
[OSAT: The Final Bottleneck in AI Chips](https://damnang2.substack.com/p/osat-the-final-bottleneck-in-ai-chips)  
55 / 6 / 2

**The Real Game Behind Terafab**  
[The Real Game Behind Terafab](https://damnang2.substack.com/p/the-real-game-behind-terafab)  
36 / 1 / 2

**The Age of the TSMC Bottleneck**  
[The Age of the TSMC Bottleneck](https://damnang2.substack.com/p/the-age-of-the-tsmc-bottleneck)  
44 / 7 / 6

**Hybrid Bonding, Fully Dissected**  
[Hybrid Bonding, Fully Dissected](https://damnang2.substack.com/p/hybrid-bonding-fully-dissected)  
46 / 2 / 7

**EMIB: Intel Foundry's Best Hope**  
[EMIB: Intel Foundry's Best Hope](https://damnang2.substack.com/p/emib-intel-foundrys-best-hope)  
42 / 4 / 9

**Terafab is Bullshit**  
[Terafab is Bullshit](https://damnang2.substack.com/p/terafab-is-bullshit)  
26 / 7 / 8

**Why Advanced Packaging is the New Frontier of the AI Era**  
[Why Advanced Packaging is the New Frontier of the AI Era](https://damnang2.substack.com/p/why-advanced-packaging-is-the-new)  
40 / 2 / 7