Damnang’s Substack

Welcome to my Substack.

Here, I share in depth analysis of semiconductor technology, companies, and industry trends in a way that is still easy for non specialists to follow.

I hope you gain many valuable insights along the way.

Over 11,000 subscribers

Packaging, Foundry & Test

Analysis of advanced packaging, foundry strategy, yield, manufacturing bottlenecks, and semiconductor test, where real competitiveness is often decided.

LATEST

If CoPoS Arrives, Who Makes Money First
If CoPoS Arrives, Who Makes Money First
43 / 3

OSAT: The Final Bottleneck in AI Chips
OSAT: The Final Bottleneck in AI Chips
55 / 6 / 2

The Real Game Behind Terafab
The Real Game Behind Terafab
36 / 1 / 2

The Age of the TSMC Bottleneck
The Age of the TSMC Bottleneck
44 / 7 / 6

Hybrid Bonding, Fully Dissected
Hybrid Bonding, Fully Dissected
46 / 2 / 7

EMIB: Intel Foundry's Best Hope
EMIB: Intel Foundry's Best Hope
42 / 4 / 9

Terafab is Bullshit
Terafab is Bullshit
26 / 7 / 8

Why Advanced Packaging is the New Frontier of the AI Era
Why Advanced Packaging is the New Frontier of the AI Era
40 / 2 / 7